V6063 3U VPX Versal® ASoC FPGA Optical I/O Module

The V6063 is a next generation heterogeneous embedded computing 3U VPX module featuring the Xilinx® Versal® Adaptive System-on-Chip (ASoC), rugged optical and electrical high-speed IO, and SOSA aligned profile options. The V6063 provides options for Versal® Prime or Versal® AI Core part selection. In a single 3U VPX card, the V6063 provides three 100G optical interfaces (300Gbps aggregate, large FPGA fabric, ARM processor cores, and optional AI engines.

The V6063 excels at high-bandwidth interface applications where data is processed or pre-processed locally and then distributed across the VPX backplane or optical interfaces. Use cases include sensor interface, data processing, data distribution, and FPGA co-processing applications. Radar, signals intelligence, electronic warfare, video, storage, medical imaging, and embedded communications systems all can benefit from the V6063 module.

By leveraging the Versal® hard silicon Ethernet interfaces, PCIe controllers, DMA engines, and associated software drivers, Xilinx® has enabled a robust ecosystem for high-bandwidth Ethernet performance. In addition to the Ethernet interfaces described, the FPGA fabric provided within the ASoC part is capable of hosting New Wave DV IP cores for Fibre Channel, ARINC-818, sFPDP, Aurora, and others. This makes the V6063 an ideal hardware platform for mixed interface protocol needs or protocol bridging applications.

The V6063 serves as a standalone data interface and processing solution in a single 3U VPX module. The V6063 provides twelve (12) full duplex optical ports supporting from 1-25Gb/s per lane, FPGA fabric resources, ARM processor cores, and AI/ML hard cores. The V6063 can also be used adjacent to CPUs and/or GPUs in a 3U VPX system. In this arrangement, the adjacent CPUs/GPUs are unburdened of the data interface overhead and can be dedicated to running high value applications and algorithms with the V6063 feeding them data directly across the backplane.

Features

  • Xilinx® Versal® ASoC (FPGA): VM1502/VM1802/VC1902
  • Up to twelve (12) 1G to 25G optical ports via MPO front panel I/O or VITA 66 optical backplane I/O
  • 2 banks of 4GB up to 1866MHz LPDDR4 SDRAM
  • PCIe Gen3/Gen4 support
  • Thermal sensors for monitoring card temperature
  • Robust FPGA development framework

Benefits

  • Heterogeneous computing card combining hard ARM processor cores, large FPGA fabric, AI Engines, and high-bandwidth interfaces
  • Designed specifically for sensor interface, AI workloads, digital signal processing, video processing, application co-processing, and secure networking
  • HPEC focus, 3U VPX, VITA 47 compliance, SOSA aligned options
  • Versatile design supports electrical or optical interfaces, optical options for both backplane or front-panel I/O
  • Modular optics for flexibility in supporting 1-25Gbs per lane

SpecificationsSpecs

Network Interface

Up to twelve (12) 1G to 25G optical ports (front & backplane options)

  • 850nm multi-mode optics

16 lanes of electrical high-speed network IO available to backplane

Optional Additional Protocols

Ethernet, Fibre Channel, sFPDP, ARINC 818, Aurora

ASoC (FPGA) Device

Xilinx® Versal™ VM1502, VM1802, VC1802, VC1902

Memory

2 banks of 4GB up to 1866MHz LPDDR4 SDRAM

PCIe Interface

Two PCI Express Gen4/Gen3 x8 Interfaces

Four PCI Express Gen4/Gen3 x4 Interfaces

Thermal Sensors

2 digital temperature sensors

Compliance

VITA 47, 48.2, 65, 66.5

Software Support

Software drivers available from NVIDIA® Mellanox®

NWDV Maintained OS’s: https://newwavedv.com/wordpress/wp-content/uploads/2021/08/V1161-software-info-2021.pdf

Physical Characteristics

Dimensions:

170.75mm length: Face of carrier to back edge of Guide pin connectors

189.22mm length: MPO flip door to back edge of Guide pin connectors

100mm width: Edge of guide rail to guide rail

24.64mm height: From primary cover to secondary cover

 

Weight:

<1.764 lbs (800g)

Power Characteristics

Power Draw: 75W

Power Supply: 12. 5V available upon request.

Temperature

Operating: -40˚ C to 85˚ C (conduction-cooled)

Storage: -55˚ C to 105˚ C

Applications App

  • Radar
  • Signal Intelligence (SIGINT)
  • Communications Intelligence (COMINT)
  • Electronic Intelligence (ELINT)
  • Electronic Warfare (EW)
  • Video
  • Heterogenous computing
  • High-performance embedded computing (HPEC)
  • FPGA co-processing
  • AI/Machine learning
  • Sensor interfacing
  • Multi-level secure networking
  • Medical Imaging
  • Embedded communications systems

Documentation Doc

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