V1163 12-Port Rugged XMC ACAP Card

The V1163 is a powerful heterogeneous computing XMC with high bandwidth IO featuring the Xilinx® Versal™ Adaptive Compute Acceleration Platform (ACAP) and rugged optical and electrical IO. The V1163 provides options for Versal Prime or Versal AI Core part selection. In a single mezzanine card, the V1163 provides 100G optical interfaces, FPGA fabric, ARM processor cores, and optional AI engines. The V1163 is designed for applications requiring any combination of the following: high speed optical/electrical interfaces, FPGA processing resources, ARM processing cores, and AI engines. Use cases include sensor interface design, digital signal processing, video processing, application co-processing, and multi-level secure networking. Radar, SIGINT, video, storage, medical imaging, and embedded communications systems all have the ability to benefit from the V1163 module.

The V1163 provides electrical and optical IO options supporting 10/25/40/50/100Gbs Ethernet. By leveraging the Versal hard silicon Ethernet interfaces, PCIe controllers, DMA engines, and associated software drivers Xilinx® has enabled a robust ecosystem for high-bandwidth Ethernet performance. In addition to the Ethernet interfaces described, the FPGA fabric provided within the ACAP part is capable of hosting New Wave DV IP cores for Fibre Channel, ARINC-818, sFPDP, Aurora, and others. This makes the V1163 an ideal hardware platform for mixed interface protocol needs or protocol bridging applications.

The convenient XMC form factor and rugged design of the V1163 can turn a VPX-based single board computer into a single-slot sensor interface and heterogeneous computing solution. The V1163 mounted on a x86 based single board computer will provide 100G optical interfaces, FPGA fabric, ARM processor cores, AI Engines, and x86 processor cores all in a single slot solution. V1163 is also available from New Wave DV in a 3U VPX form-factor instead of XMC if desired.

Get This Reconfigurable XMC Card Pre-Loaded with One of the Following IP Cores:
ExpressXG     Fibre Channel ASM     Fibre Channel ULP     sFPDP     ARINC-818

Features

  • Xilinx® Versal™ ACAP (FPGA) with AI Engines (optional)
  • Up to twelve (12) 1G to 25G optical ports via MPO front panel I/O or VITA 66 optical backplane I/O. Electrical I/O via Pn6 also available
  • Supports Dual PCIe Gen4 x8 or Gen3 x8
  • Dual banks of LPDDR4 SDRAM
  • Thermal sensors for monitoring card temperature
  • Robust FPGA development framework

Benefits

  • Heterogeneous computing card combining hard ARM processor cores, large FPGA fabric, AI Engines, and high bandwidth interfaces
  • Designed specifically for AI workloads, digital signal processing, video processing, application co-processing, and secure networking
  • Perfect system addition for workloads requiring configurable ACAP (FPGA) resources, AI Engines, ARM processors, and/or rugged optics
  • Embedded focus with VITA 20 and VITA 47 compliance
  • Versatile design supports electrical or optical interfaces, optical options for both backplane or front-panel VPX support
  • Modular optics for flexibility in supporting 1-25Gbs per lane
  • Options for 3U VPX, 6U VPX, and PXIe form factor via carrier cards

SpecificationsSpecs

Network Interface

Up to twelve (12) 1G to 25G optical ports (front & backplane options)

  • 850nm multi-mode optics

Up to eight (8) 1G to 25G electrical ports to Pn6 (high-speed mezzanine connector)

Supported Protocols

Ethernet, Fibre Channel, sFPDP, ARINC 818, Aurora

ACAP (FPGA) Device

Xilinx® Versal™ VC1902, VC1802, VM1802, VM1502

Visit Xilinx® Versal™ Datasheet

Memory

2 banks of 4GB up to 1866MHz LPDDR4 SDRAM

Host Interface

PCI Express Gen4/Gen3 x8/x16

Thermal Sensors

2 digital temperature sensors

Compliance

VITA 20, 42.3, 47, 61.0, 88

Physical Characteristics

Dimensions: 74 mm (width) x 143.75 mm (length)

Weight: 0.276 lbs

Power Characteristics

Power Draw: Maximum 70W

Power Supply: 5V to 12V

Temperature

Operating: -40˚ C to 55˚ C at 250 LFM (air-cooled)

Operating: -40˚ C to 85˚ C (conduction-cooled)

Storage: -55˚ C to 105˚ C

Applications App

  • Radar
  • SIGINT
  • Video
  • Storage
  • Medical Imaging
  • Embedded communications systems

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