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V1153 12-Port Rugged XMC FPGA Card

Purpose-built for extreme, high-bandwidth networking and interface applications, the V1153 will withstand harsh environments while staying within your SWaP and budget requirements. Despite the challenges posed to engineering architects to create boards with higher port density, bandwidth, and processing power for radar, signal intelligence, remote sensing, medical imaging, and embedded telecommunications systems, New Wave DV’s V1153 satisfies these requirements while dramatically increasing bandwidth and providing plenty of FPGA resources to process data and support PCIe host connectivity. Supporting temperature ranges from -40°C to +85°C and complying with VITA 20 standards, each V1153 XMC card delivers a reliable, long-lasting solution for your rugged embedded needs.

Get This Card Pre-Loaded with One of the Following IP Cores
ExpressXG    Fibre Channel RDMA     Fibre Channel ASM     Fibre Channel AV     sFPDP     ARINC-818

Features

  • Twelve 1G to 25G optical lanes to MPO front panel I/O or VITA 66 optical I/O.
  • Xilinx Virtex/Kintex UltraScale+ FPGA
  • Supports PCIe Gen3 x 16 and Gen4 x 8
  • PPS time synchronization with µSec resolution
  • Thermal sensors for monitoring card temperature Robust FPGA development framework
  • Advanced APIs that support multi-core and multi-processor architectures
  • Optimized Linux drivers and libraries
  • UDP offload engine for real time communication Streaming front-end FPGA core for quick sensor integration
  • Available in air and conduction-cooled XMC form factors
  • Conformal coating options available

Benefits

  • High-density FPGA XMC card for next generation data distribution and signal intelligence systems
  • VITA 20 compliant and built for harsh embedded environments
  • Versatile hardware design supports Ethernet, Fibre Channel, sFPDP, and ARINC 818-2
  • A COTS solution optimized for SWaP (size, weight and power)
  • Modular optics for greatest field flexibility from 1G to 25G
  • Real-time data streaming directly from sensors
  • Rx/Tx optical transceivers with flyover fiber cables to front panel MT connector or rear I/O

SpecificationsSpecs

Network Interface

Twelve 1G to 25G optical lanes to MPO front panel I/O or VITA 66 optical backplane I/O

Eight electrical ports to Pn6 (high-speed mezzanine connector)

Ethernet Protocols

TCP, UDP, ARP, ICMP, Multicast, Broadcast

Fibre Channel Protocols

RDMA, ASM, AV

Additional Protocols

sFPDP, ARINC 818-2

FPGA Device

Xilinx Virtex UltraScale+ (VU3P)

Xilinx Virtex UltraScale (VU065 to VU095)

Xilinx Kintex UltraScale (KU095)

Memory

One bank of 4GB to 16GB 64-bit up to 1200MHz DDR4 SDRAM

Flash

One 1Gb memory for storing a default configuration image

Host Interface

PCI Express (Gen4) x8 (Pn5)

PCI Express (Gen3) x16 (Pn5 & Pn6)

Two XAUI (Pn5), Two XAUI (Pn6)

External Interface

32 differential pairs (user configurable)

PPS Interface for time synchronization with µsecond resolution

RS-232 serial interface for debug

Thermal Sensors

2 digital temperature sensors

Compliance

VITA 20, 42.2, 42.3, 42.6, 61.0

IEEE 802.3ae 2002

IEEE 802.3ba 2010

FC-FS-3 INCITS 470-2011

Physical Characteristics

Dimensions: 74 mm (width) x 143.75 mm (length)

Weight: 0.276 lbs

Power Characteristics

Power Draw: Maximum 25W

Power Supply: 3.3V

Temperature

Operating: 0˚ C to 45˚ C at 600 LFM (air cooled)

Operating: -40˚ C to 85˚ C (conduction cooled)

Storage: -40˚ C to 85˚ C

Applications App

  • Radar
  • Signal Intelligence
  • Remote Sensing
  • Medical Imaging
  • Embedded Telecommunications
  • Data Distribution Systems