V1153 12-Port Rugged XMC FPGA Card
Purpose-built for extreme, high-bandwidth networking and interface applications, the V1153 XMC card will withstand harsh environments while staying within your SWaP and budget requirements. Despite the challenges posed to engineering architects to create boards with higher port density, bandwidth, and processing power for radar, signal intelligence, remote sensing, medical imaging, and embedded telecommunications systems, New Wave DV’s V1153 XMC card satisfies these requirements while dramatically increasing bandwidth and providing plenty of FPGA resources to process data and support PCIe host connectivity. Supporting temperature ranges from -40°C to +85°C and complying with VITA 20 standards, each V1153 XMC card delivers a reliable, long-lasting solution for your rugged embedded needs.
Get This Reconfigurable XMC Card Pre-Loaded with One of the Following IP Cores:
Ethernet RTPS Fibre Channel ASM Fibre Channel ULP sFPDP ARINC 818
Read the Whitepaper:
Combining Customizable High-Speed Interfaces with FPGA Coprocessing
Features
- Twelve 1G to 25G optical lanes to MPO front panel I/O or VITA 66 optical I/O.
- Xilinx Virtex/Kintex UltraScale+ FPGA
- Supports up to PCIe Gen3 x 16
- PPS time synchronization with µSec resolution
- Thermal sensors for monitoring card temperature
- Robust FPGA development framework
- Advanced APIs that support multi-core and multi-processor architectures
- Optimized Linux drivers and libraries
- UDP offload engine for real-time communication
- Streaming front-end FPGA core for quick sensor integration
- Available in air- and conduction-cooled XMC form factors
- Conformal coating options available
Benefits
- High-density FPGA XMC card for next generation data distribution and signal intelligence systems
- VITA 20 compliant and built for harsh embedded environments
- Versatile hardware design supports Ethernet, Fibre Channel, sFPDP, and ARINC 818-2
- A COTS solution optimized for SWaP (size, weight and power)
- Modular optics for greatest field flexibility from 1G to 25G
- Real-time data streaming directly from sensors
- Rx/Tx optical transceivers with flyover fiber cables to front panel MT connector or rear I/O
SpecificationsSpecs
| Network Interface |
Twelve 1G to 25G optical lanes to MPO front panel I/O or VITA 66 optical backplane I/O Eight electrical ports to Pn6 (high-speed mezzanine connector) |
| Ethernet Protocols |
TCP, UDP, ARP, ICMP, Multicast, Broadcast |
| Fibre Channel Protocols |
RDMA, ASM, AV |
| Additional Protocols |
sFPDP, ARINC 818-2 |
| FPGA Device |
Xilinx Virtex UltraScale+ (VU3P) Xilinx Virtex UltraScale (VU065 to VU095) Xilinx Kintex UltraScale (KU095) |
| Memory |
One bank of 8GB up to 1200MHz DDR4 SDRAM |
| Flash |
One 1Gb memory for storing a default configuration image |
| Host Interface |
PCI Express (Gen4) x8 (Pn5) PCI Express (Gen3) x16 (Pn5 & Pn6) Two XAUI (Pn5), Two XAUI (Pn6) |
| External Interface |
32 differential pairs (user configurable) PPS Interface for time synchronization with µsecond resolution RS-232 serial interface for debug |
| Thermal Sensors |
2 digital temperature sensors |
| Compliance |
VITA 20, 42.2, 42.3, 42.6, 47.1 (ECC4), 61.0 IEEE 802.3ae 2002 IEEE 802.3ba 2010 FC-FS-3 INCITS 470-2011 |
| Physical Characteristics |
74 mm (width) x 143.75 mm (length) Weight: 0.276 lbs |
| Power Characteristics |
Power Draw: Maximum 25W Power Supply: 3.3V |
| Temperature |
Operating: -40˚C to 55˚C at 250 LFM (air-cooled) Operating: -40˚C to 85˚C (conduction-cooled) Storage: -55˚C to 105˚C |
| Altitude |
Up to 60,000ft incl. Rapid Decompression |
Applications App
- Radar
- Signal Intelligence
- Remote Sensing
- Medical Imaging
- Embedded Telecommunications
- Data Distribution Systems