New Secure 4-Port Networking PMC/XMC Card and Fibre Channel IP Core with SmartFusion2 SoC FPGAs and IGLOO2 FPGAs Allow Faster Development Cycles for a Wide Range of Applications
ALISO VIEJO, Calif.—Dec. 9, 2014—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its collaboration with New Wave Design and Verification (New Wave DV) on the development of networking hardware and a Fibre Channel IP Core. Both the PMC/XMC card and the IP Core are available now for Microsemi’s SmartFusion2® SoC FPGAs and IGLOO2® FPGA devices and enable faster development cycles for new defense, aerospace, enterprise networking and storage applications which utilize Ethernet and/or Fibre Channel.
“Partnering with New Wave DV offered immediate expertise in networking domains for military and aerospace applications,” said Paul Quintana, director of vertical marketing for defense, security & computing, Microsemi. “We are able to leverage our secure industry-leading technology along with New Wave DV’s IP and industry expertise to provide a wide range of proven solutions to our customers.”
About the Fibre Channel Core
The IP Core provides standard off-the-shelf Fibre Channel IP to be implemented in an FPGA by designers and system architects. The new Fibre Channel core and application level solutions featuring the SmartFusion2 SoC FPGA or IGLOO2 FPGA create new opportunities in avionics, commercial air, defense (such as the Joint Strike Fighter program), enterprise networking and storage. According to a report by Frost and Sullivan, the global commercial aircraft fleet is going to double in number by 2020.
The Fibre Channel core provides a complete Fibre Channel solution from FC Layer 1 through FC Layer 2. At the physical layer, the core is built specifically for connecting with Microsemi SERDES. The user interface of the core provides an intuitive streaming interface for application designers.
- Full FC-1 through FC-2 functionality
- Microsemi SERDES integration
- Class 2 and Class 3 support
- N and F port support
- Supports 1G and 2G rates
- Configurable user clock interface
- Convenient user interface for application development
About the PMC/XMC Card
The four port PMC/XMC board featuring the SmartFusion2 SoC FPGA or IGLOO2 FPGA opens new opportunities with airborne, shipboard, and ground based aerospace and defense programs where network security, performance and power conservation are paramount.
Each of the four front panel ports provides up to 5G high-speed serial data links. The backside connectors can be utilized for PCI, PCIe, XAUI, SRIO or a custom interface. The board features the M2S150 SmartFusion2 SoC FPGA or the M2GL150 IGLOO2 FPGA. The board also includes onboard DDR3 and QDRII+ memory to provide for offloading and accelerating networking functions in the FPGA. Along with deployed solutions, the PMC/XMC card is utilized for test labs, integration labs, depots and service stations worldwide. The PMC/XMC standard allows for a truly modular solution that leverages high-speed secure data transfer.
PMC/XMC Boards and IP Core are currently available for purchase. For more information email email@example.com or visit https://www.microsemi.com/products/fpga-soc/design-resources/partners/newwave. Additional information can also be found on New Wave DV’s website: https://www.newwavedv.com/products/form-factor/pmc-xmc/v1141/
About New Wave DV
The New Wave DV team is made up of passionate engineers that have extensive experience designing, building, testing, and delivering FPGA-based networking systems. By providing both off-the-shelf solutions and custom engineering resources, New Wave DV is confident in meeting the requirements of customer applications. New Wave DV products and expertise are focused on high bandwidth, ultra-low latency, and specialized networking applications in aerospace, finance, telecommunications, and big data. Find out more at www.newwavedv.com or email New Wave directly at firstname.lastname@example.org.
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
“Safe Harbor” Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its collaboration with New Wave DV on the development of networking hardware and a Fibre Channel IP Core, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company’s products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company’s most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi’s future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
Source: Microsemi Corporation